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Equipment:
C_SRD_CNSI - Chem Spin Rinse Dryers (CNSI)
C_Wetbenches_C - Chem Wetbenches (CNSI)
C_Wetbenches_EIV - Chem Wetbenches (E-IV)
D_ALD_Fiji - Dep ALD - Ultratech Fiji (CNSI)
D_ALD_Savannah - Dep ALD - Ultratech Savannah (E-IV)
D_LPCVD__Reservations - Dep LPCVD Nitride/Poly/LTO - Reservations (E-IV)
D_LPCVD_LTO_Tube4 - Dep LPCVD LTO - Tystar Titan II-Tube 4 (E-IV)
D_LPCVD_Nitride_LS_Tube2 - Dep LPCVD Nitride Low Stress - Tystar-Tube2(E-IV)
D_LPCVD_Nitride_Tube2 - Dep LPCVD Nitride - Tystar-Tube 2 (E-IV)
D_LPCVD_PolySi_Tube3 - Dep LPCVD Polysilicon - Tystar-Tube 3 (E-IV)
D_Metal_CHA1_OLD - Dep e-beam Evaporator - CHA Mark 40-1(old) (E-IV)
D_Metal_CHA2_NEW - Dep e-beam Evaporator - CHA Mark 40-2(new) (E-IV)
D_Metal_CHA3_CNSI - Dep e-beam Evaporator - CHA Mark 40-3 (CNSI)
D_Metal_Sloan - Dep e-beam Evaporator - Sloan (E-IV)
D_Metal_Solution - Dep e-beam Evaporator - CHA Solution (CNSI)
D_Ox_Tube1_C - Dep Oxidation - Tystar Tytan 3600-Tube 1 (CNSI)
D_Ox_Tube1_E - Dep Oxidation - Tystar-Tube 1 (E-IV)
D_Ox_Tube2_C - Dep Oxidation - Tystar Tytan 3600-Tube 2 (CNSI)
D_Parylene_C - Dep Parylene - SCS PDS-2010 (CNSI)
D_Parylene_E - Dep Parylene - SCS 2010 (E-IV)
D_PECVD_BMR - Dep PECVD - BMR (E-IV)
D_PECVD_Plasma_Therm - Dep PECVD - Plasma Therm 790 (E-IV)
D_PECVD_Plasma_Therm_CNSI - Dep PECVD - Plasma Therm Vision (CNSI)
D_PECVD_STS - Dep PECVD - STS Multiplex CVD (E-IV)
D_Sputter_CVC - Dep Sputter - CVC 601 (E-IV)
D_Sputter_Desk_II - Dep Sputter - Denton Desk II (SEM) (E-IV)
D_Sputter_Desk_V - Dep Sputter - Denton Desk V (CNSI)
D_Sputter_Discovery - Dep Sputter - Denton Discovery (E-IV)
D_Sputter_Ulvac - Dep Sputter - Ulvac JSP-8000 (CNSI)
E_AOE - Etch Fluorine - STS AOE (E-IV)
E_Asher_Matrix - Etch Asher - Matrix 105 (E-IV)
E_Asher_Matrix_C - Etch Asher - Matrix 105 (CNSI)
E_Asher_PE100 - Etch Asher - PE100 Plasma System (CNSI)
E_Asher_Tegal - Etch Asher - Tegal (E-IV)
E_Cl2_PlasmaTherm_E - Etch Chlorine - PlasmaTherm SLR 770 ICP (E-IV)
E_Cl2_ULVAC_C - Etch Chlorine - ULVAC NE-550 (CNSI)
E_DRIE_FDRIE - Etch DRIE - PlasmaTherm DSE III FDRIE (E-IV)
E_DRIE_Unaxis - Etch DRIE - Unaxis (E-IV)
E_FIB - Etch FIB - FEI Nova 600 (E-IV)
E_HFVE - Etch HF Vapor - AMMT (E-IV)
E_Oxford_C - Etch Fluorine - Oxford 80+ (CNSI)
E_Oxford_E - Etch Fluorine - Oxford 80+ (E-IV)
E_Technics - Etch Fluorine - Technics Micro RIE 800 (E-IV)
E_ULVAC - Etch Fluorine - ULVAC NLD 570 (E-IV)
E_XeF2 - Etch XeF2 - Lee No. 1 (E-IV)
L_ASML - Litho Stepper - ASML PAS 5500/200 (CNSI)
L_Headway_C - Litho Coater - Headway PWM32 (CNSI)
L_Headway_E - Litho Coater -Headway PWM32 (E-IV)
L_KarlSuss_1 - Litho Aligner - Karl Suss 1 MA6 (E-IV)
L_KarlSuss_2 - Litho Aligner - Karl Suss 2 MA6 (E-IV)
L_KarlSuss_3 - Litho Aligner - Karl Suss 3 MA6 (E-IV)
L_KarlSuss_4 - Litho Aligner - Karl Suss 4 MA6 (CNSI)
L_MaskWriter - Litho Mask Writer - Heidlberg DWL 66 (E-IV)
L_MIVA - Litho Writer - MIVATek 1201L (CNSI)
L_MLA_150 - Litho Direct Write - Heidelberg MLA 150 (CNSI)
L_Raith - Litho e-Beam Writer - Raith EBPG 5000+ES (CNSI)
L_SVG_Coat - Litho Track Coat - SVG 8800 (CNSI)
L_SVG_Develop - Litho Track Develop - SVG 8800 (CNSI)
M_Dektak150 - Meas Profilometer - Veeco Dektak 150 (CNSI)
M_Dektak6 - Meas Profilometer - Veeco Dektak 6 (E-IV)
M_Dektak8 - Meas Profilometer - Veeco Dektak 8 (E-IV)
M_Filmtek - Meas Reflectometer - SCI Filmtek 2000 (E-IV)
M_Flexus - Meas Stress - Tencor Flexus 2320A (E-IV)
M_Goniometer - Meas Goniometer - AST 3000s (CNSI)
M_Microscope_CNSI - Meas Microscopes (CNSI)
M_Microscopes_E - Meas Microscopes (E-IV)
M_Nanospec_C - Meas Reflectometer - Nanospec 2100 (CNSI)
M_Nanospec_E - Meas Reflectometer - Nanospec 210 (E-IV)
M_Probe_C - Meas Probe - M & M (CNSI)
M_Probe_E - Meas Probe - M & M (E-IV)
M_Prometrix - Meas 4 Point Probe - Omnimap RS35C (CNSI)
M_ResMap - Meas 4 Point Probe - CDE ResMap (E-IV)
M_SEM_Hitachi - Meas SEM - Hitachi S4700 (E-IV)
M_SEM_Thermo - Meas SEM - ThermoFisher Verios 5 UC XHR (CNSI)
M_ULVAC - Meas Ellipsometer - ULVAC UNECS 2000 (E-IV)
M_Wyko - Meas Optical Profiler - Wyko NT3300 (E-IV)
MI_Bonder_KS8e - Misc Bonder - Karl Suss SB 8e (CNSI)
MI_Bonder_KSB6_1 - Misc Bonder - Karl Suss SB6-1 (E-IV)
MI_CMP_GMP - Misc Polish - G&P Poli400L (E-IV)
MI_CMP_LogiCDP - Misc Polish - Logitech CDP (E-IV)
MI_CMP_LogiPM5 - Misc Polish - Logitech PM5 (E-IV)
MI_Jelight - Misc UV Cure - Jelight 42 (CNSI)
MI_SCD_C - Misc Supercritical Dryer - Tousimis (CNSI)
MI_SCD_E - Misc Supercritical Dryer - Tousimis (E-IV)
MI_ScribeBreak - Misc Scribe and Break - Loomis LSD100 (CNSI)
MI_UV_Fusion - Misc UV - Fusion (CNSI)
T_Anneal - Therm Anneal - Tystar (E-IV)
T_Carbolite_C - Therm Oven - Carbolite HTCR6 28 (CNSI)
T_Carbolite_E - Therm Oven - Carbolite HTCR6 28 (E-IV)
T_RTP650 - Therm RTP - MPTC 650 (E-IV)
T_RTPAW610_C - Therm RTP - AllWin21 AW610M (CNSI)
T_Vac_Oven_VWR - Therm Oven - VWR Vacuum Oven (E-IV)
T_YES_HMDS_Ovem - Therm Oven HMDS - YES LPIII (CNSI)
T_YES_Vac_Oven - Therm Oven Vacuum - YES LPIII (CNSI)
Training_EIV_Lithography - Training - General Lithography (E-IV)
Chem Spin Rinse Dryers (CNSI)
Short Name:
C_SRD_CNSI
Category:
Chemical
Super Users:
None Assigned
Status:
Decommissioned
Trainings Required:
1
Location:
CNSI
Comments:
Files
No files for this machine.
Equipment Status
Date
Status
Comments
Updated By
4/10/2024 10:20:05 AM
Decommissioned
EDAX was removed from system in March 2024.
Brian Matthews
2/12/2023 11:38:34 PM
In Use
Comment...
Tom Lee
1/5/2023 9:53:30 AM
UP
Comment...
Brian Matthews
